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Akbari, Mohammadreza, Ha, Nghiep, and Kok, Seng (2022) A systematic review of AR/VR in operations and supply chain management: maturity, current trends and future directions. Journal of Global Operations and Strategic Sourcing, 15 (4). pp. 534-565.

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Dahms, Tayla S., Smith, Stephanie L., Smart, Ken W., Brodie, Graham, and Jacob, Mohan (2023) Additively Manufactured K-Band Septum Polarizers: A Comparative Study. In: Proceedings of the IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting. pp. 1793-1794. From: USNC-URSI 2023: IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, 23-28 July 2023, Portland, OR, USA.

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Jusak, Jusak, and Zhu, Randy (2023) An Internet of Things Conceptual Model and User Experience Design for Forest Hiking Systems in the Tropics Tourism. In: Innovation-driven business and sustainability in the tropics: Proceedings of the Sustainability, Economics, Innovation, Globalisation and Organisational Psychology Conference 2023. pp. 227-243. From: SEIGOP 2023: Sustainability, Economics, Innovation, Globalisation and Organisational Psychology Conference, 1-3 March 2023, Singapore.

L

Lammie, Corey (2022) Simulation and implementation of novel deep learning hardware architectures for resource constrained devices. PhD thesis, James Cook University.

P

Piyarathna, Iresha Erangani, Thabet, Ahmed Mostafa, Ucgul, Mustafa, Lemckert, Charles, Lim, Yee Yan, and Tang, Zi Sheng (2023) Linear Segmented Arc-Shaped Piezoelectric Branch Beam Energy Harvester for Ultra-Low Frequency Vibrations. Sensors, 23 (11). 5257.

Prasetyo, Jeremiah, Musayyanah, Musayyanah, and Jusak, Jusak (2023) A novel multiple access communication protocol for LoRa networks without LoraWAN. Indonesian Journal of Electrical Engineering and Computer Science, 30 (3). pp. 1440-1448.

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Suhir, E. (2022) Predictive modeling sheds useful light on burn-in testing (BIT): Brief review and recent extension. Microelectronics Reliability, 128. 114371.

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Wei, Kaixin, Shi, Peiji, Bao, Pili, Gao, Xianping, Du, Yang, and Qin, Yanzhou (2023) Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices. Applied Sciences, 13 (8). 5209.