Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices
Wei, Kaixin, Shi, Peiji, Bao, Pili, Gao, Xianping, Du, Yang, and Qin, Yanzhou (2023) Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices. Applied Sciences, 13 (8). 5209.
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Abstract
The convection thermal coupling between adjacent power devices in power converters is dependent on the ambient temperature. When the ambient temperature changes, the convection thermal coupling also changes. This results in an inaccurate thermal model that causes errors in the prediction of the thermal distribution and junction temperature based on a fixed ambient temperature for power devices in converters application. To solve this variable-ambient-temperature-related issue, a thermal coupling experiment for semiconductor power devices (the MOSFET and diode) was performed to discuss the influence of the thermal coupling effect between adjacent devices and the FEM (Finite Element Method) thermal models for the power devices considering the convection thermal coupling are established. Through these simulations, the junction temperatures of devices under different ambient temperatures were obtained, and the relationships between the junction temperature and ambient temperatures were established. Moreover, the junction temperatures of power devices under different ambient temperatures were calculated and temperature distributions are analyzed in this paper. This method shows a strong significance and has potential applications for high-efficiency and high-power density converter designs.
| Item ID: | 78958 |
|---|---|
| Item Type: | Article (Research - C1) |
| ISSN: | 2076-3417 |
| Keywords: | ambient temperature, convection thermal coupling, junction temperature, power devices, thermal coupling effect |
| Copyright Information: | © 2023 by the authors. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
| Date Deposited: | 08 Nov 2023 00:07 |
| FoR Codes: | 40 ENGINEERING > 4012 Fluid mechanics and thermal engineering > 401205 Experimental methods in fluid flow, heat and mass transfer @ 100% |
| SEO Codes: | 24 MANUFACTURING > 2404 Computer, electronic and communication equipment > 240499 Computer, electronic and communication equipment not elsewhere classified @ 100% |
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