Effects of process parameters on the adhesive strength of copper electrodeposits in a bench-scale electrowinning cell

Murray, A., Khakbaz, H., Pranowo, A., Aslin, N., and Kannan, M. Bobby (2016) Effects of process parameters on the adhesive strength of copper electrodeposits in a bench-scale electrowinning cell. Institution of Mining and Metallurgy. Transactions. Section C: Mineral Processing and Extractive Metallurgy, 125 (1). pp. 10-16.

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Abstract

In this study, the effects of various process parameters on the adhesive strength of copper electrodeposits on stainless steel cathodes produced in a laboratory scale electrowinning cell were investigated. The experimental results showed that the chloride ion concentration and the current density had a significant effect on the adhesive strength. Electrolyte temperature and cupric ion concentration also influenced the adhesive strength to some extent, whereas cobaltous ion concentration and Guar dosage showed no noticeable effect. Microstructure analysis of the copper electrodeposits indicated that the process parameters which affected the grain size of the deposit at the substrate/deposit interface influenced the adhesive strength, i.e., fine grains exhibited higher adhesive strength than coarse grains.

Item ID: 42939
Item Type: Article (Research - C1)
ISSN: 1743-2855
Keywords: copper, electrowinning, electrodeposition, adhesive strength, grain size
Date Deposited: 10 Aug 2016 04:18
FoR Codes: 09 ENGINEERING > 0912 Materials Engineering > 091207 Metals and Alloy Materials @ 100%
SEO Codes: 86 MANUFACTURING > 8611 Basic Metal Products (incl. Smelting, Rolling, Drawing and Extruding) > 861102 Basic Copper Products @ 100%
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