Tang, Z.S., Lim, Y.Y., Smith, S.T., and Sirach, N. (2019) Monitoring the strength gain of structural adhesives using the electromechanical impedance technique: An experimental investigation. In: Proceedings of the 7th Asia-Pacific Conference on FRP in Structures. 171. From: APFIS 2019: Seventh Asia-Pacific Conference on FRP in Structures, 10-13 December 2019, Gold Coast, QLD, Australia.

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Abstract

Structural adhesives are employed to externally bond fibre-reinforced polymer (FRP) composites onto concrete structures for repair and strengthening purposes. The strength development of the bond layer is important to ensure the overall performance of the FRP-strengthened system. The non-destructive piezoelectric-based monitoring technique, namely the electromechanical impedance (EMI) technique, is introduced to monitor the strength gain of structural adhesives. In this study, the curing process of the commercially available structural adhesive, Sikadur 330, was monitored using the EMI technique. Throughout the experimental study, the 7-day strength gain of the adhesive was observed from the movement of acquired frequency peaks. The frequency peaks moved noticeably to the right for the first 24 hours. After that, the rate of movement decreased significantly. An empirical equation is established to correlate the tensile strength of the adhesive to the acquired resonance frequency for different curing durations. The current study shows the capability of the EMI technique to monitor the strength gain of structural adhesives, particularly at an early age of curing.

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