Tang, Z.S., Lim, Y.Y., Smith, S.T., and Sirach, N. (2019) Monitoring the curing process of structural adhesives using the electromechanical impedance technique: A numerical investigation. In: Proceedings of the 7th Asia-Pacific Conference on FRP in Structures. 172. From: APFIS 2019: Seventh Asia-Pacific Conference on FRP in Structures, 10-13 December 2019, Gold Coast, QLD, Australia.

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Abstract

Structural adhesives act as a bonding agent to externally bond fibre-reinforced polymer (FRP) composites onto existing structures for strengthening purposes. The performance of FRP-strengthened systems are therefore affected by the strength and stiffness of the structural adhesive layer. The lead zirconate titanate (PZT)-based electromechanical impedance (EMI) technique was employed in this study to monitor the stiffness development process of structural adhesives. A finite element model was developed to investigate the interaction between the PZT patches and the structural adhesive throughout the curing process. The dynamic elastic modulus of the structural adhesives can be predicted from the simulated EMI signatures. The EMI signatures were compared with experimental results for verification purposes. An empirical equation was established to predict the elastic modulus of structural adhesives from the resonance frequency. The current study can be extended by developing a model that predicts the tensile strength of structural adhesives at different curing durations.

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