Physical design for reliability of solder joint interconnections for application in aerospace electronics

Suhir, E., Yi, S., and Nicolics, J. (2019) Physical design for reliability of solder joint interconnections for application in aerospace electronics. In: Proceedings of the IEEE International Workshop on Metrology for AeroSpace, MetroAeroSpace. 8869658. pp. 44-48. From: 2019 IEEE 5th International Workshop on Metrology for AeroSpace, 19-21 June 2019, Torino, Italy.

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Abstract

The problem and the challenge of the physical (mechanical) design for reliability of solder joint interconnections (SJIs) for aerospace electronics is addressed and some practically useful solutions to this problem are suggested and discussed in detail. The considered problem includes: 1) the possibility of avoiding inelastic strains in the solder material; 2) quantification, on the probabilistic basis, the expected lifetime of the SJI of interest; and 3) possible replacement of the temperature cycling accelerated testing with a more physically meaningful, less costly and less time-and labor consuming low-temperature/random-vibration bias. The general concepts are illustrated by numerical examples.

Item ID: 61806
Item Type: Conference Item (Research - E1)
ISBN: 978-1-7281-1344-9
Keywords: Accelerated testing, Physical design for reliability, Predicted fatigue lifetime, Probabilistic modeling, Solder joint interconnections
Copyright Information: © 2019 IEEE.
Date Deposited: 21 May 2020 02:45
FoR Codes: 40 ENGINEERING > 4009 Electronics, sensors and digital hardware > 400999 Electronics, sensors and digital hardware not elsewhere classified @ 80%
40 ENGINEERING > 4001 Aerospace engineering > 400199 Aerospace engineering not elsewhere classified @ 20%
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