Parallel and serial generated patterned DLC surfaces for creating three-dimensional polymeric stamp structures

Watson, Gregory S., Myhra, Sverre, and Watson, Jolanta A. (2011) Parallel and serial generated patterned DLC surfaces for creating three-dimensional polymeric stamp structures. Surface Science, 605 (11-12). pp. 989-993.

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Abstract

This study demonstrates pattern generation on a highly durable and flat diamond-like-carbon (DLC) film with micro/nano-scale resolution using the Atomic Force Microscope (AFM). Parallel processing (masked lithography) and serial local probe processing (maskless lithography) have both been utilized to produce a range of structure shapes at different length scales. The AFM is operated in the electrical conductivity mode which induces oxidation on the DLC surface. The technique offers features with structure depths as small as 20 nm (serial processing) and pattern replication of many centimeters (parallel processing). Moreover parallel processed structures may be further modified via serial patterning using the same instrumentation. As a result, complex shapes can be produced with a depth being controlled by the DLC film thickness and/or by the bias voltage parameters. The patterned DLC structures can be used as a template for fabrication of 3 dimensional polymeric structures.

Item ID: 18197
Item Type: Article (Research - C1)
ISSN: 0039-6028
Keywords: DLC; diamond-like-carbon; Atomic Force Microscopy; lithography; micro/nano structures; polymer; PDMS
Date Deposited: 26 Oct 2011 22:43
FoR Codes: 02 PHYSICAL SCIENCES > 0299 Other Physical Sciences > 029999 Physical Sciences not elsewhere classified @ 30%
03 CHEMICAL SCIENCES > 0399 Other Chemical Sciences > 039999 Chemical Sciences not elsewhere classified @ 30%
09 ENGINEERING > 0912 Materials Engineering > 091299 Materials Engineering not elsewhere classified @ 40%
SEO Codes: 97 EXPANDING KNOWLEDGE > 970102 Expanding Knowledge in the Physical Sciences @ 30%
97 EXPANDING KNOWLEDGE > 970103 Expanding Knowledge in the Chemical Sciences @ 30%
97 EXPANDING KNOWLEDGE > 970109 Expanding Knowledge in Engineering @ 40%
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