Contactless measurements of resistivity of semiconductor wafers employing single-post and split-post dielectric-resonator techniques

Krupka, Jerzy, and Mazierska, Janina (2007) Contactless measurements of resistivity of semiconductor wafers employing single-post and split-post dielectric-resonator techniques. IEEE Transactions on Instrumentation and Measurement, 56 (5). pp. 1839-1844.

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Abstract

Complementary single- and split-post dielectric- resonator techniques were used for contactless absolute resistivity measurements of semiconductor wafers and for onwafer resistivity mapping in the range of 10^-5 to 10^5 Omega ldr cm. Uncertainties of the resistivity measurements employing both techniques are in the range of 2%-4%. Permittivities of high-resistivity semiconductors were measured with uncertainties of approximately 0.5%. Several Silicon, GaAs, and SiC wafers were tested at room and at elevating temperatures, showing excellent repeatability of measurements.

Item ID: 2585
Item Type: Article (Refereed Research - C1)
Keywords: conductivity measurement; contactless measurements; resistivity mapping; semiconductor material measurements; SiC; silicon
ISSN: 1557-9662
Date Deposited: 24 Jul 2009 02:24
FoR Codes: 09 ENGINEERING > 0906 Electrical and Electronic Engineering > 090699 Electrical and Electronic Engineering not elsewhere classified @ 100%
SEO Codes: 86 MANUFACTURING > 8616 Computer Hardware and Electronic Equipment > 861603 Integrated Circuits and Devices @ 100%
Citation Count from Web of Science Web of Science 16
Downloads: Total: 3
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